欧美激情一区二区-国产激情在线-欧美在线一区二区-亚洲欧美综合

D-Sub高導熱系數聯系器AMPHENOL

分享時間段：2023-09-06 16:40:00     觀看：1038

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高容重無線射頻連接器平角PCB線接有這兩種芯片封裝局勢型號規格：法國發展規劃和軍用用局勢。配合題材股相處外壁一直以來都為兩面金呈黃色，能依據所需要的要的充滿配合頻帶寬度抉擇多種常規板厚：閃耀金、15μ"和30μ"。接觸的面積點才能展示 精密工作設備工作的航天軍工用級最新版本（穩定工作電流高至7.5A）以有效保障了的安全可信度性，一定會夠能提供更經濟實惠且可民用的額定電流值為3A的壓鑄新版本。

D-Sub高容重連接方式器基準系列表常從A到E的5種差不多金屬外殼技術參數，AMPHENOL的搭配鏈接器在統計資料信息、電壓和同軸拖鏈電纜這方面都具有達到了18個接觸的面積點布局。堆疊（雙端口處）D-Sub高容重接連器物品系類能比高。AMPHENOL新開通發的用在PIP對焊細長（或沉式或短型）類別在AMPHENOL的業務朋友中拿到非常成功。除此之下，AMPHENOL還能為所以用帶來了裝備，分為金屬質蓋、泡沫塑料耐磨防塵蓋、確保罩、制做裝備、寶寶血型改換和某些兼容器。

特點

細則D形銜接器

EMI五金表殼

插銷接地系統裝置設備凹坑

塞進件由抗靜電熱蠕變朔膠制作而成而成

app商務公司公章碰觸點

具備全定位線接范圍圖的變體

種種線接的規格均展示排插和電源線插頭

優勢可言

保證 合理的的結合多方面

重要用做文件批量生產加工銷售但拉低總成本的化解計劃

UL#E232356v認證

兼容各方面用戶的使用需求

按照標準化規范起來

特殊性型號適于管腳焊錫膏或流回焊

佛山市立維創展科技產業加盟經銷處AMPHENOL集團以及層面貨品產品系列，在AMPHENOL，AMPHENOL說實話在開發業務量的方式中做好綠色基礎設施保持的抉擇能能為持股人塑造一年期和短期意義。AMPHENOL的某一種銷售業務都堅持創新驅動于一個勁完善其構思，招標采購，研制和交付使用品牌的方式，努力的要求或戰勝的客戶對一個交換企業戰略中品牌管理工作的預期。AMPHENOL 的銷售將防護和周圍環境庇護充當關鍵神器任務，并給出ISO 14001和OHSAS 18001等著名原則管理工作這樣行動計劃。而且，v認證和法律解釋合規經營性還不行。AMPHENOL一方面僅知道條例就能創造者長期的作用。

詳情頁詳細了解AMPHENOL可點擊：//www.myloveidc.com/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


比較適合資訊新聞
  • 關于THUNDERLINE-Z產品申明
    關于THUNDERLINE-Z產品申明 2020-10-14 15:54:05 南京市立維創展信息技術有局限新公司，是美式THUNDERLINE-Z & Fusite產品在中國大陸地區有的代理權平臺商，其合金磨砂玻璃密封墊絕緣端子，已大范圍操作于航空工業、軍事戰爭、光纖通信等高可信度性域。
  • 282 系列線性偏振器
    282 系列線性偏振器 2025-09-19 16:44:05 282編線型偏振器是Mi-Wave推廣的低頻線型至圓偏振轉化成器，的支持12.4 - 220GHz頻段存儲，具低放進去自然損耗（主要值1.0dB）、低軸比（確定帶寬起步內≤1.0dB）、高VSWR（很大值≤1.2）等核心思想性能
欧美激情一区二区-国产激情在线-欧美在线一区二区-亚洲欧美综合 欧美激情一区二区-国产激情在线-欧美在线一区二区-亚洲欧美综合 欧美激情一区二区-国产激情在线-欧美在线一区二区-亚洲欧美综合